Specific applications

The applications include:

  • Thermal and UV-nanoimprint lithography (NIL), where materials are modified at the nanoscale by combined thermal and mechanical stresses (MRT),
  • Novel nanostructured microparticle-based interconnect materials, in which the thermal and electrical properties of metallized nanoparticles are optimised, in particular for Thermal Interface Materials (TIM) (CONPART),
  • Atomic layer deposition (ALD), in which the exquisite sensitivity of thermal imaging techniques to atomic scale interfaces will prove to be a valuable tool for process development (PICOSUN),
  • Novel generation of nanostructured TIM thermoelectric materials (THALES) as well as various nanomaterials from supporting partners of the project.